LICENSE
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LICENSE TERMS

Copyright (c)2014 Santiago Pagani, Jian-Jia Chen, Muhammad Shafique, and Jörg Henkel. All rights reserved.

Permission is hereby granted, without written agreement and without license or royalty fees, to use, copy, modify, and distribute this software and its documentation for any purpose, provided that the above copyright notice and the following four paragraphs appear in all copies of this software, whether in binary form or not.

IN NO EVENT SHALL THE AUTHORS, THE KARLSRUHE INSTITUTE OF TECHNOLOGY, OR THE TU DORTMUND BE LIABLE TO ANY PARTY FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF THIS SOFTWARE AND ITS DOCUMENTATION, EVEN IF THEY HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

THE AUTHORS, THE KARLSRUHE INSTITUTE OF TECHNOLOGY, OR THE TU DORTMUND SPECIFICALLY DISCLAIM ANY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THE SOFTWARE PROVIDED HERE IS ON AN "AS IS" BASIS, AND THE AUTHORS HAVE NO OBLIGATION TO PROVIDE MAINTENANCE, SUPPORT, UPDATES, ENHANCEMENTS, OR MODIFICATIONS.

NEITHER THE NAME OF ANY GERMAN ENTITY NOR THE NAMES OF THE CONTRIBUTORS MAY BE USED TO ENDORSE OR PROMOTE PRODUCTS DERIVED FROM THIS SOFTWARE WITHOUT SPECIFIC PRIOR WRITTEN PERMISSION.

If you use this software or a modified version of it, please cite the following paper: 
* Santiago Pagani, Jian-Jia Chen, Muhammad Shafique, and Jörg Henkel, "MatEx: Efficient Transient and Peak Temperature Computation for Compact Thermal Models", in Proceedings of the 18th IEEE/ACM Design, Automation & Test in Europe (DATE), Grenoble, France, March 2015.

Also, since the thermal model inside MatEx is obtained through HotSpot, please also cite the following paper:
* W. Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron, and M. Stan, "HotSpot: a compact thermal modeling methodology for early-stage VLSI design", in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 14, no. 5, pp. 501–513, May 2006.

